Technical characteristics

●   Develop SiC and GaN wafer scribing technology
●   Application of soft solder and high thermal conductivity Ag sintering
●   DBC multi-die stack packaging technology
●   High performance Cu clip and ribbon bonding and hybrid bonding technology
●   Packaging technology of SiC ultra-thin die
●   The product voltage can be 3300V, which meets the assessment standard of AECQ101
●   Use highly reliable green molding compound

Application Field

The third generation of semiconductors are used in mobile phone chargers, 5G base stations, electric vehicles, military fields, etc.